Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle and 4 Teeth 4 DWF With ESD vendor_PACE Heavy duty variable pitch bi-metal

Heavy duty variable pitch bi-metal holesaws for cutting wood

1/8 - 28 BSP Hex Die

Long Length For Increased Access

The PACKOUT Modular Storage allows you to customise your storage system for easy transportation and organisation of tools and accessories

controlled-feed solder/wire holder (for standard-sized spools)

Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle and 4 Teeth 4 DWF With ESD vendor_PACE Heavy duty variable pitch bi-metalOverview For positioning of flat and fine components, e. g. extremely sensitive and breakable wafer (Glass wafer etc.) fine PCB's and LCD's very smooth and non reflective surface high grade steel SA, anti magnetic. Specifications Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 17 g Special Features With graduated lower paddle and 4 teeth 4 DWF With ESD Coating For Wafer Size 3 in Jaw Size 12 mm Resources Product Brochure