Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP With cushion grip

Name: Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP With cushion grip
Brand: tlprc.org
SKU: 20307477321
Price: 109.35 USD
Availability: InStock
Rating: 4.3204 (14 reviews)

SKU 20307477321

USD109.35 USD141.35

Pay in 4 interest-free payments of $27.34 Learn more

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Ships within 48 hours · Estimated delivery Aug 30 - Sep 4

Description

With cushion grip

Part Number 14130

Single standard 9 volt battery

The case is ideal for camera equipment

Orr use with tools up to 6

Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP With cushion gripOverview Solder Paste in jar 250g (T3) SAC305 no clean 88. 5% metal. Specifications Alloy Sn96. 5 Ag3. 0 Cu0. 5 Flux Type Synthetic No Clean Flux Classification REL0 Metal Content 88. 5% metal by weight Particle Size T3 (25 45 microns) Melting Point 217 220C (423 428F) Size 250g Jar Stencil Life >8 hours @ 20 50% RH 22 28C (72 82F) >4 hours @ 50 70% RH 22 28C (72 82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted

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