Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 Die Arbeit stellt sich dieser

Die Arbeit stellt sich dieser Problematik in vier Kapiteln

2Ladder-Optionen25

im besonderen privaten

6Hybridkarten42

1Konstruktivismus30

Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 Die Arbeit stellt sich dieserThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for